DEPARTMENT OF METALLURGY AND MATERIALS ENGINEERING

Indian Institute of Engineering Science and Technology, Shibpur

Howrah-711 103

Enquiry No. 01/MET/SC/CPDA/IIEST/2015-16                                                                           Date: 09/02/2016

To,

All the Enlisted Suppliers/Dealers/Manufacturers

Sealed quotations are invited for supply of Diamond Wafering Blade under CPDA Account of Dr. Subrata Chatterjee, Professor, Dept. of Metallurgy and Materials Engineering. The sealed quotations should be addressed to the Head of the Department indicating enquiry no. with date on the top of the sealed envelope. The sealed quotations should be submitted at the office of the department on any working day up to 19/02/2016 till 5.00 P.M.

Specification of Diamond Wafering Blade:

Diamond Wafering Blade for the Mecatome T180 (Presi make) cutter. High concentration (HC) diamond wafering blade (Qty: one only) is required for cutting all metals and alloys.

Required specifications:

1. Inner diameter: 0.5” (12.7 mm)

2. Outer diameter: 5” (127 mm)

3. Thickness: 0.015” (0.381 mm)

4. Qty: 1 no. (One only)

5. Type: HC (High concentration)

(S. K. Ghosh)

          Professor& Head